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cy7c1329h 2-mbit (64 k 32) pipelined sync sram cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document #: 38-05673 rev. *e revised june 27, 2011 2-mbit (64 k 32) pipelined sync sram features registered inputs and outputs for pipelined operation 64 k 32 common i/o architecture 3.3 v core power supply 2.5 v/3.3 v i/o operation fast clock-to-output times ? 3.5 ns (for 166-mhz device) ? 4.0 ns (for 133-mhz device) provide high-performance 3-1-1-1 access rate user-selectable burst counter supporting intel ? ? pentium ? interleaved or linear burst sequences separate processor and controller address strobes synchronous self-timed write asynchronous output enable offered in jedec-standard lead-free 100-pin tqfp package ?zz? sleep mode option functional description the cy7c1329h [1] sram integrates 64 k 32 sram cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. all synchronous inputs are gated by registers controlled by a positive-edge-triggered clock input (clk). the synchronous inputs include all addresses, all data inputs, address-pipelining chip enable (ce 1 ), depth-expansion chip enables (ce 2 and ce 3 ), burst control inputs (adsc , adsp , and adv ), write enables (bw [a:d] and bwe ), and global write (gw ). asynchronous inputs include the output enable (oe ) and the zz pin. addresses and chip enables are registered at rising edge of clock when either address strobe processor (adsp ) or address strobe controller (adsc ) are active. subsequent burst addresses can be internally generated as controlled by the advance pin (adv ). address, data inputs, and write controls are registered on-chip to initiate a self-timed write cycle. this part supports byte write operations (see pin descriptions and truth table for further details). write cycles can be one to four bytes wide as controlled by the byte write control inputs. gw when active low causes all bytes to be written. the cy7c1329h operates from a +3.3 v core power supply while all outputs operate with either a +2.5 v or +3.3 v supply. all inputs and outputs are jedec-standard jesd8-5-compatible. logic block diagram address register adv clk burst counter and logic clr q1 q0 adsp adsc mode bwe gw ce 1 ce 2 ce 3 oe enable register output registers sense amps output buffers e pipelined enable input registers a0, a1, a bw b bw c bw d bw a memory array dqs sleep control zz a [1:0] 2 dq a byte write register dq b byte write register dq c byte write register dq d byte write register dq a byte write driver dq b byte write driver dq c byte write driver dq d byte write driver note 1. for best-practices recommendations, please refer to the cypress application note system design guidelines on www.cypress.com . [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 2 of 20 contents selection guide ................................................................ 3 pin configuration ............................................................. 3 pin definitions .................................................................. 4 functional overview ........................................................ 5 single read accesses ................................................ 5 single write accesse s initiated by adsp ................... 5 single write accesses initiate d by adsc ................... 5 burst sequences ......................................................... 5 sleep mode ................................................................. 5 interleaved burst address table (mode = floating or vdd) ............................................... 6 linear burst address table (mode = gnd) .................. 6 zz mode electrical characteris tics ................................. 6 truth table ........................................................................ 7 truth table for read/write .............................................. 8 maximum ratings ............................................................. 9 operating range ............................................................... 9 electrical characteristics ................................................. 9 capacitance .................................................................... 10 thermal resistance ........................................................ 10 ac test loads and waveforms ..................................... 10 switching characteristics .............................................. 11 switching waveforms .................................................... 12 ordering information ...................................................... 16 ordering code definitions ..... .................................... 16 package diagram ............................................................ 17 acronyms ........................................................................ 18 document conventions ................................................. 18 units of measure ....................................................... 18 document history page ................................................. 19 sales, solutions, and legal information ...................... 20 worldwide sales and design s upport ......... .............. 20 products .................................................................... 20 psoc solutions ......................................................... 20 [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 3 of 20 selection guide 166 mhz 133 mhz unit maximum access time 3.5 4.0 ns maximum operating current 240 225 ma maximum cmos standby current 40 40 ma pin configuration figure 1. 100-pin tqfp pinout a a a a a 1 a 0 nc/72m nc/36m v ss v dd nc/18m nc/9m a a a a a a nc/4m nc dq b dq b v ddq v ssq dq b dq b dq b dq b v ssq v ddq dq b dq b v ss nc v dd zz dq a dq a v ddq v ssq dq a dq a dq a dq a v ssq v ddq dq a dq a nc nc dq c dq c v ddq v ssq dq c dq c dq c dq c v ssq v ddq dq c dq c nc v dd nc v ss dq d dq d v ddq v ssq dq d dq d dq d dq d v ssq v ddq dq d dq d nc a a ce 1 ce 2 bw d bw c bw b bw a ce 3 v dd v ss clk gw bwe oe adsc adsp adv a a 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 mode byte a byte b byte d byte c cy7c1329h [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 4 of 20 pin definitions name i/o description a 0 , a 1 , a input- synchronous address inputs used to select one of the 64k address locations . sampled at the rising edge of the clk if adsp or adsc is active low, and ce 1 , ce 2 , and ce 3 are sampled active. a 1 , a 0 feed the 2-bit counter. bw a ,bw b , bw c , bw d input- synchronous byte write select inputs, active low . qualified with bwe to conduct byte writes to the sram. sampled on the rising edge of clk. gw input- synchronous global write enable input, active low . when asserted low on the rising edge of clk, a global write is conducted (all bytes are written, regardless of the values on bw [a:d] and bwe ). bwe input- synchronous byte write enable input, active low . sampled on the rising edge of clk. this signal must be asserted low to conduct a byte write. clk input- clock clock input . used to capture all synchronous inputs to t he device. also used to increment the burst counter when adv is asserted low, during a burst operation. ce 1 input- synchronous chip enable 1 input, active low . sampled on the rising edge of clk. used in conjunction with ce 2 and ce 3 to select/deselect the device. adsp is ignored if ce 1 is high. ce 1 is sampled only when a new external address is loaded. ce 2 input- synchronous chip enable 2 input, active high . sampled on the rising edge of clk. used in conjunction with ce 1 and ce 3 to select/deselect the device. ce 2 is sampled only when a new external address is loaded. ce 3 input- synchronous chip enable 3 input, active low . sampled on the rising edge of clk. used in conjunction with ce 1 and ce 2 to select/deselect the device. not connected for bga. where referenced, ce 3 is assumed active throughout this document for bga. ce 3 is sampled only when a new external address is loaded. oe input- asynchronous output enable, asynchronous input, active low . controls the direction of the i/o pins. when low, the i/o pins behave as outputs. when deasserted high, i/o pins are tri-stated, and act as input data pins. oe is masked during the first clock of a read cycle when emerging from a deselected state. adv input- synchronous advance input signal, sampled on the rising edge of clk , active low . when asserted, it automat- ically increments the address in a burst cycle. adsp input- synchronous address strobe from processor, sampled on the rising edge of clk, active low . when asserted low, a is captured in the address registers. a 1 , a 0 are also loaded into the burst counter. when adsp and adsc are both asserted, only adsp is recognized. asdp is ignored when ce 1 is deasserted high. adsc input- synchronous address strobe from controller, sampled on the rising edge of clk, active low . when asserted low, a is captured in the address registers. a 1 , a 0 are also loaded into the burst counter. when adsp and adsc are both asserted, only adsp is recognized. zz input- asynchronous zz ?sleep? input, active high . this input, when high places the device in a non-time-critical ?sleep? condition with data integrity preserved. for normal opera tion, this pin has to be low or left floating. zz pin has an internal pull-down. dq a , dq b dq c , dq d i/o- synchronous bidirectional data i/o lines . as inputs, they feed into an on-chip dat a register that is triggered by the rising edge of clk. as outputs, they deliver the data contained in the memory location specified by ?a? during the previous clock rise of the read cycle. the direction of the pins is controlled by oe . when oe is asserted low, the pins behave as outputs. w hen high, dq are placed in a tri-state condition. v dd power supply power supply inputs to the core of the device . v ss ground ground for the core of the device . v ddq i/o power supply power supply for the i/o circuitry . v ssq i/o ground ground for the i/o circuitry . mode input- static selects burst order . when tied to gnd selects linear burst sequence. when tied to v dd or left floating selects interleaved burst sequence. this is a strap pin and should remain static during device operation. mode pin has an internal pull-up. nc no connects . not internally connected to the die. 4m, 9m, 18m, 72m, 144m, 288m, 576m and 1g are address expansion pins and are not internally connected to the die. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 5 of 20 functional overview all synchronous inputs pass through input registers controlled by the rising edge of the clock. all data outputs pass through output registers controlled by the ri sing edge of the clock. the cy7c1329h supports secondary cache in systems utilizing either a linear or interleaved burst sequence. the interleaved burst order supports pentium and i486 ? processors. the linear burst sequence is suited for proces sors that utilize a linear burst sequence. the burst order is user selectable, and is determined by sampling the mode input. accesses can be initiated with either the processor address strobe (adsp ) or the controller address strobe (adsc ). address advancement through the burst sequence is controlled by the adv input. a two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. byte write operations are qualif ied with the byte write enable (bwe ) and byte write select (bw [a:d] ) inputs. a global write enable (gw ) overrides all byte write inputs and writes data to all four bytes. all writes are simplified with on-chip synchronous self-timed write circuitry. three synchronous chip selects (ce 1 , ce 2 , ce 3 ) and an asynchronous output enable (oe ) provide for easy bank selection and output tri-state control. adsp is ignored if ce 1 is high. single read accesses this access is initiated when the following conditions are satisfied at clock rise: (1) adsp or adsc is asserted low, (2) ce 1 , ce 2 , ce 3 are all asserted active, and (3) the write signals (gw , bwe ) are all deasserted high. adsp is ignored if ce1 is high. the address presented to the address inputs (a) is stored into the address advancement logic and the address register while being presented to the memory array. the corresponding data is allowed to propagate to the input of the output registers. at the rising edge of the next clock the data is allowed to propagate through the output register and onto the data bus within t co if oe is active low. the only exception occurs when the sram is emer ging from a deselected state to a selected state, its outputs are always tri-stated during the first cycle of the access. after the first cycle of the access, the outputs are controlled by the oe signal. consecutiv e single read cycles are supported. once the sram is deselected at clock rise by the chip select and either adsp or adsc signals, its output will tri-state immediately. single write accesses initiated by adsp this access is initiated when both of the following conditions are satisfied at clock rise: (1) adsp is asserted low, and (2) ce 1 , ce 2 , ce 3 are all asserted active. the address presented to a is loaded into the address register and the address advancement logic while being delivered to the ram array. the write signals (gw , bwe , and bw [a:d] ) and adv inputs are ignored during this first cycle. adsp -triggered write accesses require two clock cycles to complete. if gw is asserted low on th e second clock rise, the data presented to the dq inputs is written into the corresponding address location in the memory array. if gw is high, then the write operation is controlled by bwe and bw [a:d] signals. the cy7c1329h provides byte write capability that is described in the write cycle descriptions table. asserting the byte write enable input (bwe ) with the selected byte write (bw [a:d] ) input, will selectively write to only the desired bytes. bytes not selected during a byte write operation will remain unaltered. a synchronous self-timed write mechanism has been provided to simplify the write operations. because the cy7c1329h is a common i/o device, the output enable (oe ) must be deasserted high before presenting data to the dq inputs. doing so will tr i-state the output drivers. as a safety precaution, dqs are autom atically tri-stated whenever a write cycle is detec ted, regardless of the state of oe . single write accesses initiated by adsc adsc write accesses are initiated when the following conditions are satisfied: (1) adsc is asserted low, (2) adsp is deasserted high, (3) ce 1 , ce 2 , ce 3 are all asserted active, and (4) the appropriate combination of the write inputs (gw , bwe , and bw [a:d] ) are asserted active to conduct a write to the desired byte(s). adsc -triggered write accesses require a single clock cycle to complete. the address pres ented to a is loaded into the address register and the address advancement logic while being delivered to the memory array. the adv input is ignored during this cycle. if a global write is conducted, the data presented to dq is written into the corresponding address location in the memory core. if a byte write is conducted, only the selected bytes are written. bytes not selected during a byte write operation will remain unaltered. a synchronous self-timed write mechanism has been provided to simplify the write operations. because the cy7c1329h is a common i/o device, the output enable (oe ) must be deasserted high before presenting data to the dq inputs. doing so will tr i-state the output drivers. as a safety precaution, dqs are autom atically tri-stated whenever a write cycle is detec ted, regardless of the state of oe . burst sequences the cy7c1329h provides a two- bit wraparound counter, fed by a 1 , a 0 , that implements either an interleaved or linear burst sequence. the interleaved burst sequence is designed specifically to support intel pentium applications. the linear burst sequence is designed to support processors that follow a linear burst sequence. the burst sequence is user selectable through the mode input.asserting adv low at clock rise will automatically increment the burst counter to the next address in the burst sequence. both read and write burst operations are supported. sleep mode the zz input pin is an asynchronous input. asserting zz places the sram in a power conservation ?sleep? mode. two clock cycles are required to enter into or exit from this ?sleep? mode. while in this mode, data inte grity is guaranteed. accesses pending when entering the ?sleep? mode are not considered valid nor is the completion of the operation guaranteed. the device must be deselected prior to entering the ?sleep? mode. ce 1 , ce 2 , ce 3 , adsp , and adsc must remain inactive for the duration of t zzrec after the zz input returns low. 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cy7c1329h document #: 38-05673 rev. *e page 6 of 20 interleaved burst address table (mode = floating or v dd ) first address a 1 , a 0 second address a 1 , a 0 third address a 1 , a 0 fourth address a 1 , a 0 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 linear burst address table (mode = gnd) first address a 1 , a 0 second address a 1 , a 0 third address a 1 , a 0 fourth address a 1 , a 0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 zz mode electrical characteristics parameter description test conditions min max unit i ddzz sleep mode standby current zz > v dd ? ? 0.2 v ? 40 ma t zzs device operation to zz zz > v dd ? 0.2 v ? 2t cyc ns t zzrec zz recovery time zz < 0.2 v 2t cyc ?ns t zzi zz active to sleep current t his parameter is sampled ? 2t cyc ns t rzzi zz inactive to exit sleep current this parameter is sampled 0 ? ns [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 7 of 20 truth table [2, 3, 4, 5, 6, 7] next cycle address used address used ce 1 ce 2 ce 3 zz adsp adsc adv write oe unselected none none h x x l x l x x x unselected none none l l x l l x x x x unselected none none l x h l l x x x x unselected none none l l x l h l x x x unselected none none l x h l h l x x x begin read external none x x x h x x x x x begin read external external l h l l l x x x l continue read next external l h l l l x x x h continue read next external l h l l h l x l x continue read next external l h l l h l x h l continue read next external l h l l h l x h h suspend read current next x x x l h h l h l suspend read current suspend read current next x x x l h h l h h suspend read current next h x x l x h l h l begin write current next h x x l x h l h h begin write current next x x x l h h l l x begin write external next h x x l x h l l x continue write next current x x x l h h h h l continue write next current x x x l h h h h h suspend write current current h x x l x h h h l suspend write current current h x x l x h h h h zz ?sleep? none current x x x l h h h l x notes 2. x = ?don't care.? h = logic high, l = logic low. 3. write = l when any one or more byte write enable signals (bw a , bw b , bw c , bw d ) and bwe = l or gw = l. write = h when all byte write enable signals (bw a , bw b , bw c , bw d ), bwe , gw = h. 4. the dq pins are controlled by the current cycle and the oe signal. oe is asynchronous and is not sampled with the clock. 5. ce 1 , ce 2 , and ce 3 are available only in the tqfp package. 6. the sram always initiates a read cycle when adsp is asserted, regardless of the state of gw , bwe , or bw [a:d] . writes may occur only on subsequent clocks after the adsp or with the assertion of adsc . as a result, oe must be driven high prior to the start of the write cycle to allow the outputs to tri-state. oe is a don't care for the remainder of the write cycle. 7. oe is asynchronous and is not sampled with the clock rise. it is masked internally during write cycles. during a read cycle all d ata bits are tri-state when oe is inactive or when the device is deselected, and all data bits behave as output when oe is active (low). [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 8 of 20 truth table for read/write [8, 9] function gw bwe bw d bw c bw b bw a read h h x x x x read hlhhhh write byte a ? dq a hlhhhl write byte b ? dq b hlhhlh write bytes b, a h l h h l l write byte c ? dq c hlhlhh write bytes c, a h l h l h l write bytes c, b h l h l l h write bytes c, b, a h l h l l l write byte d ? dq d hllhhh write bytes d, a h l l h h l write bytes d, b h l l h l h write bytes d, b, a h l l h l l write bytes d, c h l l l h h write bytes d, c, a h l l l h l write bytes d, c, b h l l l l h write all bytes h l l l l l write all bytes l x x x x x notes 8. x = ?don't care.? h = logic high, l = logic low. 9. write = l when any one or more byte write enable signals (bw a , bw b , bw c , bw d ) and bwe = l or gw = l. write = h when all byte write enable signals (bw a , bw b , bw c , bw d ), bwe , gw = h. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 9 of 20 maximum ratings exceeding maximum ratings may s horten the useful life of the device. user guidelines are not tested. storage temperature ............................... ?65 ? c to +150 ?? c ambient temperature with power applied ... .............. .............. .......... ?55 ? c to +125 ? c supply voltage on v dd relative to gnd .....?0.5 v to +4.6 v supply voltage on v ddq relative to gnd .... ?0.5 v to +v dd dc voltage applied to outputs in tri-state ........................................?0.5 v to v ddq + 0.5 v dc input voltage ................................ ?0.5 v to v dd + 0.5 v current into outputs (low) .... .................................... 20 ma static discharge voltage (per mil-std-883, method 3015) .............. ........... > 2001 v latch-up current ................................................... > 200 ma operating range range ambient temperature v dd v ddq commercial 0 c to +70 c 3.3 v ? ? 5% / + 10% 2.5 v ? 5% to v dd industrial ?40 c to +85 c electrical characteristics over the operating range parameter [10, 11] description test conditions min max unit v dd power supply voltage 3.135 3.6 v v ddq i/o supply voltage for 3.3 v i/o 3.135 v dd v for 2.5 v i/o 2.375 2.625 v v oh output high voltage for 3.3 v i/o, i oh = ?4.0 ma 2.4 ? v for 2.5 v i/o, i oh = ?1.0 ma 2.0 ? v v ol output low voltage for 3.3 v i/o, i ol = 8.0 ma ? 0.4 v for 2.5 v i/o, i ol = 1.0 ma ? 0.4 v v ih input high voltage [10] for 3.3 v i/o 2.0 v dd + 0.3 v v for 2.5 v i/o 1.7 v dd + 0.3 v v v il input low voltage [10] for 3.3 v i/o ?0.3 0.8 v for 2.5 v i/o ?0.3 0.7 v i x input leakage current except zz and mode gnd ? v i ? v ddq ?5 5 ? a input current of mode input = v ss ?30 ? ? a input = v dd ? 5 ? a input current of zz input = v ss ?5 ? ? a input = v dd ? 30 ? a i oz output leakage current gnd ? v i ? v ddq, output disabled ?5 5 ? a i dd v dd operating supply current v dd = max, i out = 0 ma, f = f max = 1/t cyc 6-ns cycle,166 mhz ? 240 ma 7.5-ns cycle,133 mhz ? 225 ma i sb1 automatic cs power-down current?ttl inputs v dd = max, device deselected, v in ? v ih or v in ? v il , f = f max = 1/t cyc 6-ns cycle, 166 mhz ? 100 ma 7.5-ns cycle,133 mhz ? 90 ma i sb2 automatic cs power-down current?cmos inputs v dd = max, device deselected, v in ?? 0.3 v or v in > v ddq ? 0.3 v, f = 0 all speeds ? 40 ma notes 10. overshoot: v ih (ac) < v dd + 1.5 v (pulse width less than t cyc /2), undershoot: v il (ac) > ?2 v (pulse width less than t cyc /2). 11. t power-up : assumes a linear ramp from 0 v to v dd (min.) within 200 ms. during this time v ih < v dd and v ddq < v dd . [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 10 of 20 i sb3 automatic cs power-down current?cmos inputs v dd = max, device deselected, or v in ? 0.3 v or v in > v ddq ? 0.3 v, f = f max = 1/t cyc 6-ns cycle, 166 mhz ? 85 ma 7.5-ns cycle,133 mhz ? 75 ma i sb4 automatic cs power-down current?ttl inputs v dd = max, device deselected, v in ? v ih or v in ? v il , f = 0 all speeds ? 45 ma capacitance parameter [12] description test conditions 100-pin tqfp max unit c in input capacitance t a = 25 ? c, f = 1 mhz, v dd = 3.3 v, v ddq = 2.5 v 5 pf c clk clock input capacitance 5pf c i/o input/output capacitance 5pf thermal resistance parameter [12] description test conditions 100-pin tqfp package unit ? ja thermal resistance (junction to ambient) test conditions follow standard test methods and procedures for measuring thermal impedance, per eia/jesd51 30.32 ? c/w ? jc thermal resistance (junction to case) 6.85 ? c/w ac test loads and waveforms figure 2. ac test loads and waveforms electrical characteristics over the operating range parameter [10, 11] description test conditions min max unit output r = 317 ? r = 351 ? 5pf including jig and scope (a) (b) output r l = 50 ?? z 0 = 50 ?? v t = 1.5 v 3.3 v all input pulses v ddq gnd 90% 10% 90% 10% ? 1 ns ? 1 ns (c) output r = 1667 ? r =1538 ? 5pf including jig and scope (a) (b) output r l = 50 ?? z 0 = 50 ?? v t = 1.25 v 2.5 v all input pulses v ddq gnd 90% 10% 90% 10% ? 1 ns ? 1 ns (c) 3.3 v i/o test load 2.5 v i/o test load note 12. tested initially and after any design or process change that may affect these parameters. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 11 of 20 switching characteristics over the operating range parameter [13, 14] description 166 mhz 133 mhz unit min max min max t power v dd (typical) to the first access [15] 1?1?ms clock t cyc clock cycle time 6.0 ? 7.5 ? ns t ch clock high 2.5 ? 3.0 ? ns t cl clock low 2.5 ? 3.0 ? ns output times t co data output valid after clk rise ? 3.5 ? 4.0 ns t doh data output hold after clk rise 1.5 ? 1.5 ? ns t clz clock to low z [16, 17, 18] 0?0?ns t chz clock to high z [16, 17, 18] ? 3.5 ? 4.0 ns t oev oe low to output valid ? 3.5 ? 4.5 ns t oelz oe low to output low z [16, 17, 18] 0?0?ns t oehz oe high to output high z [16, 17, 18] ? 3.5 ? 4.0 ns set-up times t as address set-up before clk rise 1.5 ? 1.5 ? ns t ads adsc , adsp set-up before clk rise 1.5 ? 1.5 ? ns t advs adv set-up before clk rise 1.5 ? 1.5 ? ns t wes gw , bwe , bw [a:d] set-up before clk rise 1.5 ? 1.5 ? ns t ds data input set-up before clk rise 1.5 ? 1.5 ? ns t ces chip enable set-up before clk rise 1.5 ? 1.5 ? ns hold times t ah address hold after clk rise 0.5 ? 0.5 ? ns t adh adsp , adsc hold after clk rise 0.5 ? 0.5 ? ns t advh adv hold after clk rise 0.5 ? 0.5 ? ns t weh gw , bwe , bw [a:d] hold after clk rise 0.5 ? 0.5 ? ns t dh data input hold after clk rise 0.5 ? 0.5 ? ns t ceh chip enable hold after clk rise 0.5 ? 0.5 ? ns notes 13. timing reference level is 1.5 v when v ddq = 3.3 v and is 1.25 v when v ddq = 2.5 v. 14. test conditions shown in (a) of figure 2 on page 10 unless otherwise noted. 15. this part has a voltage regulator internally; t power is the time that the power needs to be supplied above v dd (minimum) initially before a read or write operation can be initiated. 16. t chz , t clz ,t oelz , and t oehz are specified with ac test conditions shown in part (b) of figure 2 on page 10 . transition is measured 200 mv from steady-state voltage. 17. at any given voltage and temperature, t oehz is less than t oelz and t chz is less than t clz to eliminate bus contention between srams when sharing the same data bus. these specifications do not imply a bus contention condition, but reflect paramete rs guaranteed over wo rst case user condi tions. device is designed to achieve high z prior to low z under the same system conditions. 18. this parameter is sampled and not 100% tested. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 12 of 20 switching waveforms figure 3. read cycle timing [19] t cyc t cl clk adsp t adh t ads address t ch oe adsc ce t ah t as a1 t ceh t ces gw, bwe, bw[a:d] data out (q) high-z t clz t doh t co adv t oehz t co single read burst read t oev t oelz t chz adv suspends burst. burst wraps around to its initial state t advh t advs t weh t wes t adh t ads q(a2) q(a2 + 1) q(a2 + 2) q(a1) q(a2) q(a2 + 1) q(a2 + 3) a2 a3 deselect cycle burst continued with new base address don?t care undefined note 19. on this diagram, when ce is low, ce 1 is low, ce 2 is high and ce 3 is low. when ce is high, ce 1 is high or ce 2 is low or ce 3 is high. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 13 of 20 figure 4. write cycle timing [20, 21] switching waveforms (continued) t cyc t cl clk adsp t adh t ads address t ch oe adsc ce t ah t as a1 t ceh t ces bwe, bw[a :d] data out (q) high-z adv burst read burst write d(a2) d(a2 + 1) d(a2 + 1) d(a1) d(a3) d(a3 + 1) d(a3 + 2) d(a2 + 3) a2 a3 data in (d) extended burst write d(a2 + 2) single write t adh t ads t adh t ads t oehz t advh t advs t weh t wes t dh t ds gw t weh t wes byte write signals are ignored for first cycle when adsp initiates burst adsc extends burst adv suspends burst don?t care undefined notes 20. on this diagram, when ce is low, ce 1 is low, ce 2 is high and ce 3 is low. when ce is high, ce 1 is high or ce 2 is low or ce 3 is high. 21. full width write can be initiated by either gw low; or by gw high, bwe low and bw [a : d] low. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 14 of 20 figure 5. read/write cycle timing [22, 23, 24] switching waveforms (continued) t cyc t cl clk adsp t adh t ads address t ch oe adsc ce t ah t as a2 t ceh t ces bwe, bw[a:d] data out (q) high-z adv single write d(a3) a4 a5 a6 d(a5) d(a6) data in (d) burst read back-to-back reads high-z q(a2) q(a1) q(a4) q(a4+1) q(a4+2) t weh t wes q(a4+3) t oehz t dh t ds t oelz t clz t co back-to-back writes a1 don?t care undefined a3 notes 22. on this diagram, when ce is low, ce 1 is low, ce 2 is high and ce 3 is low. when ce is high, ce 1 is high or ce 2 is low or ce 3 is high. 23. the data bus (q) remains in high z following a write cycle unless an adsp , adsc , or adv cycle is performed. 24. gw is high. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 15 of 20 figure 6. zz mode timing [25, 26] switching waveforms (continued) t zz i supply clk zz t zzrec all inputs (except zz) don?t care i ddzz t zzi t rzzi outputs (q) high-z deselect or read only notes 25. device must be deselected when entering zz mode. see cycle desc riptions table for all possible signal conditions to deselect the device. 26. dqs are in high z when exiting zz sleep mode. [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 16 of 20 ordering code definitions ordering information cypress offers other versions of this type of product in many different configurations and features. the following table contai ns only the list of parts that are currently available. for a complete listing of all options, visit the cypress website at www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. cypress maintains a worldwide network of offices, solution cent ers, manufacturer?s representativ es and distributors. to find th e office closest to you, visit us at http://www.cypress.com/go/datasheet/offices . speed (mhz) ordering code package diagram package type operating range 133 CY7C1329H-133AXC 51-85050 100-pin thin quad flat pack (14 20 1.4 mm) pb-free commercial temperature range: c = commercial pb-free package type: ax = 100-pin tqfp speed: 133 mhz process technology: greater than or equal to 90 nm 1329 = scd, 064 k 32 (2 mb) technology code: c = cmos marketing code: 7 = sram company id: cy = cypress c cy 1329 - 133 x 7 c h a [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 17 of 20 package diagram figure 7. 100-pin tqfp (14 20 1.4 mm) a100ra, 51-85050 51-85050 *d [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 18 of 20 acronyms document conventions units of measure acronym description ce chip enable cmos complementary metal oxide semiconductor i/o input/output oe output enable sram static random access memory tqfp thin quad flat pack ttl transistor-transistor logic symbol unit of measure c degree celsius a micro amperes s micro seconds ma milli amperes mm milli meter ms milli seconds mv milli volts mw milli watts mhz mega hertz ns nano seconds % percent pf pico farad vvolts wwatts [+] feedback
cy7c1329h document #: 38-05673 rev. *e page 19 of 20 document history page document title: cy7c1329h, 2-mbit (64 k 32) pipelined sync sram document number: 38-05673 rev. ecn no. issue date orig. of change description of change ** 347357 see ecn pci new data sheet *a 424820 see ecn rxu converted from preliminary to final. changed address of cypress semiconductor corporation on page# 1 from ?3901 north first street? to ?198 champion court? changed three-state to tri-state. modified ?input load? to ?input leakag e current except zz and mode? in the electrical characteristics table. modified test condition from v ih < v dd to v ih ?? v dd replaced package name column with package diagram in the ordering infor- mation table. updated the ordering information table. replaced package diagram of 51-85050 from *a to *b *b 433014 see ecn nxr included 3.3v i/o option updated the ordering information table. *c 2896585 03/20/2010 njy removed obsolete part num bers from ordering information table and updated package diagrams. *d 3052882 10/08/2010 njy removed obsolete part num bers from ordering information table and added ordering definitions. *e 3293640 06/27/2011 njy updated package diagram . added acronyms and units of measure . updated in new template. [+] feedback
document #: 38-05673 rev. *e revised june 27, 2011 page 20 of 20 i486 is a trademark, and intel and pentium are registered trademarks, of intel corporation. powerpc is a registered trademark o f ibm corporation. all products and company names mentioned in this document may be the trademarks of their respective holders. cy7c1329h ? cypress semiconductor corporation, 2005-2011. the information contained herein is subject to change without notice. cypress s emiconductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or other rights. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement wi th cypress. furthermore, cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. any source code (software and/or firmware) is owned by cypress semiconductor corporation (cypress) and is protected by and subj ect to worldwide patent protection (united states and foreign), united states copyright laws and internatio nal treaty provisions. cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the cypress source code and derivative works for the sole purpose of creating custom software and or firmware in su pport of licensee product to be used only in conjunction with a cypress integrated circuit as specified in the applicable agreement. any reproduction, modification, translation, compilation, or repre sentation of this source code except as specified above is prohibited without the express written permission of cypress. disclaimer: cypress makes no warranty of any kind, express or implied, with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. cypress reserves the right to make changes without further notice to t he materials described herein. cypress does not assume any liability arising out of the application or use of any product or circuit described herein. cypress does not authori ze its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress? prod uct in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. use may be limited by and subject to the applicable cypress software license agreement. sales, solutions, and legal information worldwide sales and design support cypress maintains a worldwide network of offices, solution center s, manufacturer?s representatives, and distributors. to find t he office closest to you, visit us at cypress locations . products automotive cypress.co m/go/automotive clocks & buffers cypress.com/go/clocks interface cypress. com/go/interface lighting & power control cypress.com/go/powerpsoc cypress.com/go/plc memory cypress.com/go/memory optical & image sensing cypress.com/go/image psoc cypress.com/go/psoc touch sensing cyp ress.com/go/touch usb controllers cypress.com/go/usb wireless/rf cypress.com/go/wireless psoc solutions psoc.cypress.com/solutions psoc 1 | psoc 3 | psoc 5 [+] feedback

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